Skip to main content
Polytronix — Manufacturing & Engineering
Capability

PCB Assembly

Use Cases
  • Display controller boards
  • Power supply boards
  • Interface and I/O boards
  • Backlight driver boards
  • Custom electronics

IPC-A-610 Class 2/3 workmanship with SMT, BGA, coating, programming, in-process inspection, and full board test support.

Let's Talk

Overview

Polytronix provides PCB assembly services for display controllers, power supplies, and custom electronics built for aerospace, defense, industrial, and medical applications. Our assembly operations support IPC Class 2 and Class 3 workmanship across surface mount (SMT), through-hole, mixed-technology, and BGA placement, with comprehensive in-process inspection and end-of-line testing. Deliverables include assembled PCBAs, fully tested boards, and conformal-coated units ready for installation or downstream integration.

We assemble simple 2- and 4-layer boards through complex multi-layer high-density designs with fine-pitch BGA, micro-BGA, and QFP components on rigid, flex, rigid-flex, and HDI substrates. Ruggedization through conformal coating, underfill, staking, and potting is integrated into the build flow rather than applied as an afterthought, supporting extended-temperature operation and harsh-environment service.

Our PCBA shop runs automated SMT lines with forced-convection reflow ovens, selective soldering systems, in-line 3D solder paste inspection (SPI), automated optical inspection (AOI), and 2D/3D X-ray inspection (AXI) for hidden joints and BGA verification. We support quick-turn prototypes, New Product Introduction (NPI) builds, low- and high-volume production, and rework, repair, and warranty depot service. All under traceable, ESD-controlled workflows. Specialty processes include in-house conformal coating, encapsulation and epoxy potting, BGA rework, and component programming for microcontrollers, EEPROMs, and FPGAs. Workmanship is performed and certified to IPC-A-610 Class 2 and Class 3 and IPC J-STD-001, with full DFM/DFT engineering support and moisture-sensitive device handling per IPC-A-610 CIS (Certified IPC Specialist) and IPC/WHMA-A-620 CIT (Certified IPC Trainer).

Our PCBA operations are certified under AS9100D, ISO 9001, ISO 13485, ISO 14001, IATF 16949, ITAR, UL, IPC, FAA 145, and EASA Part 145.

At a Glance

Key specifications at a glance
CertificationsAS9100D, IPC-A-610 Class 2/3, IPC J-STD-001
Program FitAerospace, Defense, Industrial, Medical
Core StrengthsSMT, BGA, Inspection, Test
Typical DeliverablesPCBAs, Tested Boards, Coated Units
Volume RangePrototype to Production

PCB Assembly Types

  • Surface mount technology (SMT) assemblies
  • Through-hole technology (THT) assemblies
  • Mixed-technology assemblies
  • BGA, fine-pitch BGA, and micro-BGA placement
  • Double-sided assemblies
  • Rigid, flex, and rigid-flex assemblies
  • High-density interconnect (HDI) builds
  • Display controller boards
  • Power supply assemblies
  • Conformal-coated, underfilled, staked, and potted PCBAs
  • Custom and build-to-print electronics
  • Prototype, NPI, and rework / repair builds

Relevant Capabilities

Surface mount technology (SMT)

High-speed SMT placement lines support component sizes through large BGAs, with forced-convection reflow profiling tuned per-build. Supports double-sided placement and mixed-technology assemblies with controlled solder paste deposition and verified placement accuracy.

Through-hole and selective soldering

Manual and selective soldering of through-hole components for high-reliability and high-current connections, performed and certified to IPC J-STD-001. Selective soldering systems eliminate wave-soldering constraints on mixed-technology boards and protect adjacent SMT components.

Fine-pitch, BGA, and micro-BGA placement

Precision placement of fine-pitch, very-fine-pitch BGA, and micro-BGA components, supported by 2D/3D X-ray inspection and AOI for hidden-joint verification. Used on display controllers, power supplies, and mission-critical assemblies.

Rigid, flex, and rigid-flex assembly

Assembly support for rigid, flexible, and rigid-flex board constructions, with fixturing, handling, and reflow profiles adapted to substrate behavior, mechanical flex zones, and bend-radius constraints.

Conformal coating

In-house conformal coating using acrylic, urethane, silicone, and parylene systems per customer specification, with selective masking and post-coat inspection for thickness and coverage. Provides moisture, chemical, and contamination protection for extended-temperature service.

Explore Ruggedization

Underfill

Application of underfill on BGA and CSP components to improve mechanical robustness under shock and vibration. Used on display controllers and high-density assemblies destined for airborne and ruggedized service.

Explore Ruggedization

Staking

Adhesive staking of tall, heavy, or vibration-sensitive components - including connectors, transformers, and electrolytic capacitors - to prevent lead fatigue and component movement under shock and vibration loads.

Explore Ruggedization

Encapsulation and potting

Epoxy potting and encapsulation for environmental sealing, vibration resistance, and tamper resistance on power supplies, ruggedized assemblies, and security-critical boards.

Explore Ruggedization

Component programming

In-house programming of microcontrollers, EEPROMs, FPGAs, and other programmable devices, performed in-line or off-line as part of the build flow, with verification and lot tracking.

Relevant Applications

Aerospace

Display controllers, instrument-bay PCBAs, and avionics electronics for fixed-wing, rotary-wing, and unmanned platforms, built to AS9100D and IPC-A-610 Class 3 with underfilled and staked components for shock and vibration service.

Explore Aerospace & Defense

Defense

Mission-system PCBAs, power supplies, and custom electronics for ITAR-controlled programs, delivered under traceable, audited workflows with conformal coating and potting for ruggedized service.

Explore Military Programs

Industrial

Control, instrumentation, and power-electronics PCBAs for manufacturing, energy, and utility customers, supported by IATF 16949 and ISO 9001 quality systems.

Explore Industrial Equipment

Medical

PCBAs for diagnostic, monitoring, imaging, and therapeutic devices manufactured under ISO 13485, with full material traceability and documentation for regulatory submission.

Explore Medical & Life Sciences

Standards and Compliance

IPC workmanship standards

  • IPC-A-610 - Acceptability of Electronic Assemblies (Class 2/3)
  • IPC J-STD-001 - Soldered Electrical and Electronic Assemblies
  • IPC/WHMA-A-620 - Acceptability of Cable, Wire, and Harness Assemblies
  • IPC/JEDEC J-STD-033 - Moisture-Sensitive Device Handling

Additional compliance

  • ANSI/ESD S20.20 - ESD-controlled production
  • RoHS / Lead-Free - environmental compliance options

Discuss Your PCB Assembly Requirements

Share your specifications. We confirm fit and provide guidance.

Start a ProjectView All Capabilities

Quality & Compliance

Polytronix maintains active third-party registrations across three U.S. facilities and international operations. Certifications are audited annually by accredited registrars.

View Certifications
  • AS9100D
  • ISO 9001
  • ISO 13485
  • ISO 14001
  • IATF 16949
  • ITAR
  • UL
  • IPC
  • FAA 145
  • EASA Part 145