Skip to main content
Polytronix — Manufacturing & Engineering

PCB Assembly

Use Cases
  • Display controller boards
  • Power supply boards
  • Interface and I/O boards
  • Backlight driver boards
  • Custom electronics

IPC-A-610 Class 2/3 workmanship with SMT, BGA, coating, programming, in-process inspection, and full board test support.

Let's Talk

Polytronix makes PCB assemblies (PCBAs) - display controller boards, power supply boards, and custom electronics - with SMT, through-hole, mixed-technology, and BGA placement built to IPC-A-610 Class 2/3 and IPC J-STD-001 for aerospace, defense, industrial, and medical applications.

Overview

Polytronix provides PCB assembly services for display controllers, power supplies, and custom electronics built for aerospace, defense, industrial, and medical applications. Our assembly operations support IPC Class 2 and Class 3 workmanship across surface mount (SMT), through-hole, mixed-technology, and BGA placement, with comprehensive in-process inspection and end-of-line testing. Deliverables include assembled PCBAs, fully tested boards, and conformal-coated units ready for installation or downstream integration.

We assemble simple 2- and 4-layer boards through complex multi-layer high-density designs with fine-pitch BGA, micro-BGA, and QFP components on rigid, flex, rigid-flex, and HDI substrates. Ruggedization through conformal coating, underfill, staking, and potting is integrated into the build flow rather than applied as an afterthought, supporting extended-temperature operation and harsh-environment service.

Our PCBA shop runs automated SMT lines with forced-convection reflow ovens, selective soldering systems, in-line 3D solder paste inspection (SPI), automated optical inspection (AOI), and 2D/3D X-ray inspection (AXI) for hidden joints and BGA verification. We support quick-turn prototypes, New Product Introduction (NPI) builds, low minimum order quantities, large production runs, and rework, repair, and warranty depot service. All under traceable, ESD-controlled workflows. Specialty processes include in-house conformal coating, encapsulation and epoxy potting, BGA rework, and component programming for microcontrollers, EEPROMs, and FPGAs. Workmanship is performed and certified to IPC-A-610 Class 2 and Class 3 and IPC J-STD-001, with full DFM/DFT engineering support and moisture-sensitive device handling per IPC-A-610 CIS (Certified IPC Specialist) and IPC/WHMA-A-620 CIT (Certified IPC Trainer).

Our PCBA operations run under AS9100D and ISO 9001:2015 registration (Richardson, TX campus; PRI Certification cert 20204) and ITAR registration, building to IPC-A-610 and J-STD-001 workmanship standards.

At a Glance

Key specifications at a glance
CertificationsAS9100D, IPC-A-610 Class 2/3, IPC J-STD-001
Program FitAerospace, Defense, Industrial, Medical
Core StrengthsSMT, BGA, Inspection, Test
Typical DeliverablesPCBAs, Tested Boards, Coated Units
Order QuantitiesPrototypes to Production Runs

PCB Assembly Scope

Placement Technologies

  • Surface mount technology (SMT) assemblies
  • Through-hole technology (THT) assemblies
  • Mixed-technology assemblies
  • BGA, fine-pitch BGA, and micro-BGA placement

Board Constructions

  • Double-sided assemblies
  • Rigid, flex, and rigid-flex assemblies
  • High-density interconnect (HDI) builds

Board Types

  • Display controller boards
  • Power supply assemblies

Ruggedization & Program Support

  • Conformal-coated, underfilled, staked, and potted PCBAs
  • Custom and build-to-print electronics
  • Prototype, NPI, and rework / repair builds

Relevant Applications

Aerospace

Display controllers, instrument-bay PCBAs, and avionics electronics for fixed-wing, rotary-wing, and unmanned platforms, built to AS9100D and IPC-A-610 Class 3 with underfilled and staked components for shock and vibration service.

Explore Aerospace & Defense

Defense

Mission-system PCBAs, power supplies, and custom electronics for ITAR-controlled programs, delivered under traceable, audited workflows with conformal coating and potting for ruggedized service.

Explore Military Programs

Industrial

Control, instrumentation, and power-electronics PCBAs for manufacturing, energy, and utility customers, supported by IATF 16949 and ISO 9001 quality systems.

Explore Industrial Equipment

Medical

PCBAs for diagnostic, monitoring, imaging, and therapeutic devices manufactured under ISO 13485, with full material traceability and documentation for regulatory submission.

Explore Medical & Life Sciences

Relevant Capabilities

Surface mount technology (SMT)

High-speed SMT placement lines support component sizes through large BGAs, with forced-convection reflow profiling tuned per-build. Supports double-sided placement and mixed-technology assemblies with controlled solder paste deposition and verified placement accuracy.

Through-hole and selective soldering

Manual and selective soldering of through-hole components for high-reliability and high-current connections, performed and certified to IPC J-STD-001. Selective soldering systems eliminate wave-soldering constraints on mixed-technology boards and protect adjacent SMT components.

Fine-pitch, BGA, and micro-BGA placement

Precision placement of fine-pitch, very-fine-pitch BGA, and micro-BGA components, supported by 2D/3D X-ray inspection and AOI for hidden-joint verification. Used on display controllers, power supplies, and mission-critical assemblies.

Rigid, flex, and rigid-flex assembly

Assembly support for rigid, flexible, and rigid-flex board constructions, with fixturing, handling, and reflow profiles adapted to substrate behavior, mechanical flex zones, and bend-radius constraints.

Conformal coating

In-house conformal coating using acrylic, urethane, silicone, and parylene systems per customer specification, with selective masking and post-coat inspection for thickness and coverage. Provides moisture, chemical, and contamination protection for extended-temperature service.

Explore Ruggedization

Underfill

Application of underfill on BGA and CSP components to improve mechanical robustness under shock and vibration. Used on display controllers and high-density assemblies destined for airborne and ruggedized service.

Explore Ruggedization

Staking

Adhesive staking of tall, heavy, or vibration-sensitive components - including connectors, transformers, and electrolytic capacitors - to prevent lead fatigue and component movement under shock and vibration loads.

Explore Ruggedization

Encapsulation and potting

Epoxy potting and encapsulation for environmental sealing, vibration resistance, and tamper resistance on power supplies, ruggedized assemblies, and security-critical boards.

Explore Ruggedization

Component programming

In-house programming of microcontrollers, EEPROMs, FPGAs, and other programmable devices, performed in-line or off-line as part of the build flow, with verification and lot tracking.

Standards and Compliance

IPC workmanship standards

  • IPC-A-610 - Acceptability of Electronic Assemblies (Class 2/3)Conformance
  • IPC J-STD-001 - Soldered Electrical and Electronic AssembliesConformance
  • IPC/WHMA-A-620 - Acceptability of Cable, Wire, and Harness AssembliesConformance
  • IPC/JEDEC J-STD-033 - Moisture-Sensitive Device HandlingReferenced

Additional compliance

  • ANSI/ESD S20.20 - ESD-controlled productionReferenced
  • RoHS / Lead-Free - environmental compliance optionsConformance

Conformance claimedReferenced

Frequently Asked Questions

Who makes PCB assemblies (PCBAs) for aerospace and defense?
Polytronix makes PCB assemblies for display controllers, power supplies, and custom electronics built for aerospace, defense, industrial, and medical applications. Our operations support IPC Class 2 and Class 3 workmanship across surface mount (SMT), through-hole, mixed-technology, and BGA placement, with in-process inspection and end-of-line testing. Deliverables include assembled PCBAs, fully tested boards, and conformal-coated units.
What board types and technologies can Polytronix assemble?
Polytronix assembles simple 2- and 4-layer boards through complex multi-layer high-density designs with fine-pitch BGA, micro-BGA, and QFP components on rigid, flex, rigid-flex, and HDI substrates. Ruggedization through conformal coating, underfill, staking, and potting is integrated into the build flow, supporting extended-temperature operation and harsh-environment service.
What inspection and test does Polytronix run on PCBAs?
Polytronix runs automated SMT lines with in-line 3D solder paste inspection (SPI), automated optical inspection (AOI), and 2D/3D X-ray inspection (AXI) for hidden joints and BGA verification. Board test includes flying probe, in-circuit testing (ICT), functional bench testing, boundary scan, burn-in, environmental stress screening (ESS), and ionic contamination testing.
Is Polytronix PCB assembly AS9100D and ITAR registered?
Polytronix PCBA operations run under AS9100D and ISO 9001:2015 registration (Richardson, TX campus; PRI Certification cert 20204) and ITAR registration, building to IPC-A-610 and IPC J-STD-001 workmanship standards. Specialty processes include in-house conformal coating, encapsulation and epoxy potting, BGA rework, and component programming for microcontrollers, EEPROMs, and FPGAs.

Discuss Your PCB Assembly Requirements

Send your Gerbers and BOM. We confirm DFM, IPC class, and build schedule before you commit.

Start a ProjectView All Capabilities

Quality & Compliance

Polytronix maintains active third-party registrations spanning aerospace, medical, automotive, and environmental quality systems, verified by accredited registrars.

View Certifications
  • Registered: AS9100DAerospace QMS
  • Registered: ISO 9001:2015Richardson, TX
  • Registered: ISO 13485:2016Medical devices
  • Registered: ISO 14001:2015Environmental
  • Registered: IATF 16949:2016Automotive
  • Registered: FAA Part 145Repair Station 8PTR524C
  • Compliant: EASA Part 145US–EU bilateral recognition
  • Registered: ITARDDTC registration